Yesterday, Realme CEO Madhav Sheth shared a photo of Realme’s new phone next to a pile of credit cards to tease its slim profile. Although Sheth did not disclose the name of the device, GSMArena said it learned from internal sources that it would be on the market as Realme X9.
As can be seen from the picture, the thickness of Realme X9 is only six credit cards. This phone comes with a colorful back cover of the “realme” and “Dare to Leap” brands.
The bottom edge of the device has a speaker grill, a USB-C port and a microphone. There is no 3.5mm auudio jack on the bottom edge of the phone. It is not clear if there is a headphone slot on the top edge of the phone.
How many cards are there? #XisTheFuture pic.twitter.com/mAUmMNQ4ML
— Madhav FutureX (@MadhavSheth1) January 19, 2021
The design of the Realme X9 is similar to the Realme V15 5G that officially launched in China earlier this month. The phone has not yet been made available outside the domestic market.
It remains to be seen if the Realme X9 will appear as a rebranded version of the Realme V15 5G that does not have a 3.5mm audio jack or a microSD card slot.